Tungsten-Copper Alloy Foil 25x50mm 0.125mm W60Cu40

Tungsten-Copper Alloy Foil 25x50mm 0.125mm W60Cu40

• Composition: W60Cu40
• Product Type: Foil
• Dimensions: 25 x 50mm
• Thickness: 0.125mm
• Synonyms: W 180210

Discover the high-quality Tungsten-Copper Alloy Foil 25x50mm 0.125mm W60Cu40, featuring a composition of W60Cu40. This alloy is primarily composed of 60% tungsten (W) and 40% copper (Cu), resulting in a material that combines the excellent properties of both elements. The foil is presented in a convenient and versatile form, specifically designed for use as a thin sheet, making it suitable for a wide range of applications.

The Tungsten-Copper Alloy Foil 25x50mm 0.125mm W60Cu40 is rectangular in shape with dimensions of 25 x 50mm, providing a compact size that can be easily manipulated and integrated into various systems. The foil has a thickness of 0.125mm, ensuring a balance between flexibility and durability, making it suitable for both delicate and robust applications.

One of the key benefits of the Tungsten-Copper Alloy Foil 25x50mm 0.125mm W60Cu40 is its exceptional conductivity. Tungsten is known for its excellent electrical conductivity, while copper is renowned for its outstanding thermal conductivity. The combination of these two elements in the alloy results in a material that exhibits high electrical and thermal conductivity, making it an ideal choice for applications involving electronic components and heat sinks.

Key Features:

• High-quality Tungsten-Copper Alloy Foil
• Composition: W60Cu40
• Product Type: Foil
• Dimensions: 25 x 50mm
• Thickness: 0.125mm
• Convenient and versatile thin sheet form
• Exceptional electrical conductivity
• Outstanding thermal conductivity
• Ideal for electronic components and heat sinks
• Suitable for a wide range of applications

In electronic components, the Tungsten-Copper Alloy Foil 25x50mm 0.125mm W60Cu40 can be used as a conductor or current-carrying member due to its excellent electrical conductivity. It allows for efficient transmission of electrical signals, ensuring optimal performance in devices such as transistors, capacitors, and integrated circuits.

When it comes to heat sinks, the Tungsten-Copper Alloy Foil 25x50mm 0.125mm W60Cu40 provides remarkable thermal conductivity, allowing for efficient heat dissipation. The foil can effectively transfer and distribute heat away from heat-generating components, preventing overheating and ensuring the reliability and longevity of electronic devices.

The W 180210 Tungsten-Copper Alloy Foil offers exceptional performance and versatility. Its unique composition and properties make it a valuable material for various industries including electronics, aerospace, automotive, telecommunications, and more. Whether you are designing electronic circuits, manufacturing heat sinks, or conducting research and development, this foil is a reliable choice.

With its composition of W60Cu40, dimensions of 25 x 50mm, and a thickness of 0.125mm, the Tungsten-Copper Alloy Foil 25x50mm 0.125mm W60Cu40 offers excellent conductivity and thermal properties, making it suitable for electronic components and heat sinks. Choose the Tungsten-Copper Alloy Foil 25x50mm 0.125mm W60Cu40 for exceptional performance and reliability in your applications.